Metal level formation method and an integrated circuit structure having a metal level with improved dielectric to metal adhesion

ABSTRACT

Disclosed is a method of forming back end of the line (BEOL) metal levels with improved dielectric capping layer to metal wire adhesion. The method includes process step(s) designed to address dielectric capping layer to metal wire adhesion, when the metal wire(s) in a given metal level are relatively thick. These process step(s) can include, for example: (1) selective adjustment of the deposition tool used to deposit the dielectric capping layer onto metal wires based on the pattern density of the metal wires in order to ensure that those metal wires actually achieve a temperature between 360° C.-400° C.; and/or (2) deposition of a relatively thin dielectric layer on the dielectric capping layer prior to formation of the next metal level in order to reduce the tensile stress of the metal wire(s) below without causing delamination. Also disclosed is an IC chip formed using the above-described method.

FIELD OF THE INVENTION

The present invention relates to back end of the line (BEOL) metallevels on an integrated circuit (IC) chip and, more specifically, to ametal level formation method and an IC chip having a BEOL metal levelwith improved dielectric to metal adhesion.

BACKGROUND

More particularly, integrated circuit (IC) chips are formed with backend of the line (BEOL) metal levels. Each metal level can comprise metalwires (e.g., copper wires) that fill trenches with a layer of interlayerdielectric (ILD) material. Typically, at each metal level, the metalwires and adjacent ILD material will be capped with a dielectric cappinglayer (e.g., a silicon nitride capping layer), which minimizeselectromigration (EM) and functions as an etch stop layer duringformation of upper metal levels. In any case, these metal wires canfunction as interconnects, which provide electrical connections toon-chip devices (e.g., through vias and/or other metal wires) and/or tooff-chip devices (e.g., through vias, other metal wires and/orinput/output pins). Additionally, these metal wires can function aspassive devices, such as inductors or resistors, or components thereof.Recently, passive devices with very thick metal wires (e.g., metal wireswith a height that is greater than 2 μm, metal wires with a height thatis greater than 3 μm, etc.) have been incorporated into IC chip designs.Unfortunately, the resulting IC chips tend to exhibit a relatively highrate of occurrence of delamination of the metal wires from thedielectric capping layer above and, thereby exhibit a relatively highfail rate due to opens and other structural defects resulting from thedelamination. Thus, there is a need in the art for a BEOL metal levelformation method that can provide relatively thick metal wires without acorresponding increase in the rate of occurrence for delamination.

SUMMARY

In view of the foregoing, disclosed herein are embodiments of a methodof forming back end of the line (BEOL) metal levels with improveddielectric capping layer to metal wire adhesion. The embodiments includeone or more process steps that are designed to address dielectriccapping layer to metal wire adhesion, when the metal wire(s) in a givenmetal level are relatively thick (e.g., >1 μm, >2 μm, >3 μm, >5 μm,etc.). These process steps can include, for example: (1) selectiveadjustment of the deposition tool that is used to deposit the dielectriccapping layer onto metal wires based on the pattern density of the metalwires in order to ensure that those metal wires actually achieve atemperature between 360° C.-400° C.; and/or (2) deposition of arelatively thin dielectric layer onto the dielectric capping layer priorto formation of the next metal level in order to reduce the tensilestress of the metal wire(s) below without causing delamination. Alsodisclosed herein are embodiments of an IC chip that is formed using theabove described method embodiments and that thereby has a BEOL metallevel with improved dielectric capping layer to metal wire adhesion.

More specifically, an embodiment of a method of forming BEOL metallevels with improved dielectric capping layer to metal wire adhesion cancomprise forming a metal level above a substrate. Specifically, a firstdielectric layer, having a first thickness, can be formed above thesubstrate. A trench can be formed in the first dielectric layer. Thetrench can be relatively deep (e.g., >1 μm, >2 μm, >3 μm, >5 μm, etc.)and can be filled with a metal material, thereby forming relativelythick metal wire. A second dielectric layer (referred to herein as adielectric capping layer) can be formed on the first dielectric layer.The second dielectric layer can be formed so that it has a secondthickness, so that it extends over the trench and so that it isimmediately adjacent to the metal wire contained therein. Next, a thirddielectric layer, having a third thickness, can be formed on the seconddielectric layer. The first thickness of the first dielectric layer, aswell as the depth of the trench, can be relatively large and,specifically, greater than both the second thickness of the seconddielectric layer and the third thickness of the third dielectric layer.That is, both the second dielectric layer and the third dielectric layercan be relatively thin. Subsequently, an additional metal level can beformed on the third dielectric layer.

In a more specific embodiment, the metal level formed can comprise asilicon nitride capping layer over copper wires and the method canspecifically be design to improve silicon nitride capping layer tocopper wire adhesion. That is, this embodiment of the method cancomprise forming a metal level above a substrate. Specifically, a firstdielectric layer, having a first thickness, can be formed above thesubstrate. Trenches can be formed in the first dielectric layer. Thesetrenches can be relatively deep (e.g., >1 μm, >2 μm, >3 μm, >5 μm, etc.)and can be filled with copper, thereby forming relatively thick copperwires. A second dielectric layer (referred to herein as a dielectriccapping layer) can be formed on the first dielectric layer. The seconddielectric layer can comprise a silicon nitride layer and can be formedso that it has a second thickness, so that it extends over the trenchesand so that it is immediately adjacent to the copper wires containedtherein. More specifically, this second dielectric layer (i.e., thesilicon nitride layer) can be formed using a plasma-enhanced chemicalvapor deposition process that results in self-aligned copper silicidelayers being formed in the upper portions of the trenches at theinterfaces between the silicon nitride layer and the copper wires. Thesecopper silicide layers provide for better adhesion between the seconddielectric layer and the copper wires below, thereby minimizingdelamination of the second dielectric layer from the copper wires below.Next, a third dielectric layer, having a third thickness, can be formedon the second dielectric layer. The first thickness of the firstdielectric layer, as well as the depth of the trenches, can berelatively large and, specifically, greater than both the secondthickness of the second dielectric layer and the third thickness of thethird dielectric layer. That is, both the second dielectric layer andthe third dielectric layer can be relatively thin. Subsequently, anadditional metal level can be formed on the third dielectric layer.

In an even more specific embodiment, the metal level formed can comprisea silicon nitride capping layer over copper wires and the method canspecifically be design to improve silicon nitride capping layer tocopper wire adhesion by selectively adjusting the tool used to depositthe silicon nitride capping layer based on the pattern density of thosecopper wires in order to ensure that copper wires achieve a temperaturebetween 360° C.-400° C. during capping layer deposition. That is, thisembodiment of the method can comprise forming a metal level above asubstrate. Specifically, a first dielectric layer, having a firstthickness, can be formed above the substrate. Trenches can be formed inthe first dielectric layer. These trenches can be relatively deep(e.g., >1 μm, >2 μm, >3 μm, >5 μm, etc.) and can be filled with copper,thereby forming relatively thick copper wires. A second dielectric layer(referred to herein as a dielectric capping layer) can be formed on thefirst dielectric layer. The second dielectric layer can comprise asilicon nitride layer and can be formed so that it has a secondthickness, so that it extends over the trenches and so that it isimmediately adjacent to the copper wires contained therein. Morespecifically, this second dielectric layer (i.e., the silicon nitridelayer) can be formed using a plasma-enhanced chemical vapor depositionprocess that results in self-aligned copper silicide layers being formedin the upper portions of the trenches at the interfaces between thesilicon nitride layer and the copper wires. In this case, plasmaexposure time used during the plasma-enhanced chemical vapor depositionprocess can be set based on the pattern density of the copper wires inorder to ensure that the copper wires achieve a temperature between 360°C.-400° C. during capping layer deposition and, thereby in order toensure that the resulting copper silicide layers fill at least the upper1-3% of each of the trenches. Thus, in cases where the trenches are, forexample, approximately 3 μm deep, the copper silicide layers will beapproximately 30-90 nm thick. The relatively thick copper silicidelayers provide for even better adhesion between the second dielectriclayer and the copper wires below, thereby minimizing delamination of thesecond dielectric layer from the copper wires below. Next, a thirddielectric layer, having a third thickness, can be formed on the seconddielectric layer. The first thickness of the first dielectric layer, aswell as the depth of the trenches, can be relatively large and,specifically, greater than both the second thickness of the seconddielectric layer and the third thickness of the third dielectric layer.That is, both the second dielectric layer and the third dielectric layercan be relatively thin. Subsequently, an additional metal level can beformed on the third dielectric layer.

It should be noted that in each of the above-described methods theprocess of depositing the third dielectric layer effectively heats themetal wire(s) below (e.g., the copper wire(s) below) causing them toexpand and, thereby reducing the tensile stress exhibit by the wire(s).Reducing the tensile stress reduces the pull downward by the metalwire(s) against the second dielectric layer (i.e., against thedielectric capping layer). Since this process which heats the metalwire(s) to reduce tensile stress is performed prior to formation of anadditional metal level, which is relatively thick and un-flexible, andsince it results in only a thin third dielectric layer being formed,when the metal wire(s) eventually cool and contract the thin thirddielectric layer can flex minimizing the opposing forces that couldresult in delamination of the second dielectric layer from the metalwire(s) below.

Also disclosed herein are embodiments of an IC chip that is formed usingthe above described method embodiments and that thereby has a BEOL metallevel with improved dielectric capping layer to metal wire adhesion.

Specifically, an embodiment of an IC chip structure can comprise asubstrate and a metal level above the substrate. The metal level cancomprise a first dielectric layer, having a first thickness, a bottomsurface and a top surface opposite the bottom surface. A trench canextend vertically into the first dielectric layer from the top surfaceand a metal material can fill the trench, thereby forming a metal wire.A second dielectric layer (referred to herein as a dielectric cappinglayer), having a second thickness, can be above and immediately adjacentto the top surface of the first dielectric layer. This second dielectriclayer can further extend over the trench and can be immediately adjacentto the metal wire contained therein. A third dielectric layer, having athird thickness, can be above and immediately adjacent to the seconddielectric layer. The first thickness of the first dielectric layer, aswell as the depth of the trench, can be relatively large and,specifically, greater than both the second thickness of the seconddielectric layer and the third thickness of the third dielectric layer.That is, both the second dielectric layer and the third dielectric layercan be relatively thin. An additional metal level can be above andimmediately adjacent to the third dielectric layer.

In a more specific embodiment, the metal level in the IC chip structurecan comprise a silicon nitride capping layer over copper wires and canbe formed so as to have improve silicon nitride capping layer to copperwire adhesion. Specifically, this embodiment of an IC chip structure cancomprise a substrate and a metal level above the substrate. The metallevel can comprise a first dielectric layer, having a first thickness, abottom surface and a top surface opposite the bottom surface. Trenchescan extend vertically into the first dielectric layer from the topsurface and copper can fill the trenches, thereby forming copper wires.A second dielectric layer (referred to herein as a dielectric cappinglayer), having a second thickness, can be above and immediately adjacentto the top surface of the first dielectric layer. This second dielectriclayer can further extend over the trench and can be immediately adjacentto the metal wire contained therein. The second dielectric layer cancomprise, for example, silicon nitride layer and, due to the processused when forming this silicon nitride layer, the IC chip structure canfurther comprise self-aligned copper silicide layers at the interfacesbetween the silicon nitride layer and the copper wires. The coppersilicide layers can, for example, fill at least the upper 1-3% of eachof the trenches. Thus, in cases where the trenches are, for example,approximately 3 μm deep, the copper silicide layers will beapproximately 30-90 nm thick. The relatively thick copper silicidelayers provide for better adhesion between the second dielectric layerand the copper wires below, thereby minimizing delamination of thesecond dielectric layer from the copper wires below. A third dielectriclayer, having a third thickness, can be above and immediately adjacentto the second dielectric layer. The first thickness of the firstdielectric layer, as well as the depth of the trench, can be relativelylarge and, specifically, greater than both the second thickness of thesecond dielectric layer and the third thickness of the third dielectriclayer. That is, both the second dielectric layer and the thirddielectric layer can be relatively thin. An additional metal level canbe above and immediately adjacent to the third dielectric layer.

It should be noted that in each of the above-described IC chipstructures the thin third dielectric layer is flexible during processingprior to formation of the additional metal level, thereby allowing themetal wire(s) below to expand and contract without significant opposingforces being exerted at the interface(s) between the second dielectriclayer and the metal wire(s) Thus, formation of this third dielectriclayer between the second dielectric layer and the additional metallevel, minimizes delamination of the second dielectric layer from themetal wire(s) below.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The present invention will be better understood from the followingdetailed description with reference to the drawings, which are notnecessarily drawn to scale and in which:

FIG. 1 is a flow diagram illustrating a method of forming BEOL metallevels with improved dielectric capping layer to metal wire adhesion;

FIG. 2 is a cross-section diagram illustrating a partially completedstructure formed according to the method of FIG. 1;

FIG. 3 is a cross-section diagram illustrating a partially completedstructure formed according to the method of FIG. 1;

FIG. 4 is a cross-section diagram illustrating a partially completedstructure formed according to the method of FIG. 1;

FIG. 5 is a cross-section diagram illustrating a partially completedstructure formed according to the method of FIG. 1;

FIG. 6A is a cross-section diagram illustrating a partially completedstructure formed according to the method of FIG. 1;

FIG. 6B is a cross-section diagram illustrating an alternative partiallycompleted structure formed according to the method of FIG. 1, when themetal wire pattern density is low;

FIG. 7 is an exemplary look-up table (LUT) that can be used inconjunction with the method of FIG. 1;

FIG. 8 is a cross-section diagram illustrating a partially completedstructure formed according to the method of FIG. 1;

FIG. 9 is a cross-section diagram illustrating a partially completedstructure formed according to the method of FIG. 1;

FIG. 10 is a cross-section diagram illustrating a partially completedstructure formed according to the method of FIG. 1; and,

FIG. 11 is a cross-section diagram illustrating a structure formedaccording to the method of FIG. 1.

DETAILED DESCRIPTION

As mentioned above, integrated circuit (IC) chips are formed with backend of the line (BEOL) metal levels. Each metal level can comprise metalwires (e.g., copper wires) that fill trenches with a layer of interlayerdielectric (ILD) material. Typically, at each metal level, the metalwires and adjacent ILD material will be capped with a dielectric cappinglayer (e.g., a silicon nitride capping layer), which minimizeselectromigration (EM) and functions as an etch stop layer duringformation of upper metal levels. In any case, these metal wires canfunction as interconnects, which provide electrical connections toon-chip devices (e.g., through vias and/or other metal wires) and/or tooff-chip devices (e.g., through vias, other metal wires and/orinput/output pins). Additionally, these metal wires can function aspassive devices, such as inductors or resistors, or components thereof.Recently, passive devices with very thick metal wires (e.g., metal wireswith a height that is greater than 2 μm, metal wires with a height thatis greater than 3 μm, metal wires with a height that is greater than 5μm, etc.) have been incorporated into IC chip designs. Unfortunately,the resulting IC chips tend to exhibit a relatively high rate ofoccurrence of delamination of the metal wires from the dielectriccapping layer above and, thereby exhibit a relatively high fail rate dueto opens and other structural defects resulting from the delamination.Thus, there is a need in the art for a BEOL metal level formation methodthat can provide relatively thick metal wires without a correspondingincrease in the rate of occurrence for delamination.

Those skilled in the art will recognize that the high rate of occurrenceof delamination is due to a reduction in adhesion of the dielectriccapping layer to the thick metal wires below. In developing techniquesfor minimizing the occurrence of delamination, the present inventorshave found three distinct factors that effect dielectric capping layerto metal wire adhesion: (1) the thickness of the metal wires onto whichthe dielectric capping layer is deposited; (2) the pattern factor of themetal wires onto which the dielectric capping layer is deposited and,thereby the temperature of the metal wires during deposition of thedielectric capping layer; and (3) the thickness of the next layer of ILDmaterial for the next metal level above and immediately adjacent to thedielectric capping layer. Specifically, the present inventors have foundthat metal wires tend to exhibit tensile stress, causing those metalwires to pull downward and away from the dielectric capping layer. Theamount of tensile stress exhibited by a metal wire is a function of thethickness of the metal wire with relatively thick metal wires (e.g.,metal wires with a height that is greater than 2 μm, metal wires with aheight that is greater than 3 μm, metal wires with a height that isgreater than 5 μm, etc.) exhibiting a sufficient amount of stress tocause delamination with current metal level configurations. The presentinventors have further found that there is a significant correlationbetween the pattern density of the metal wires onto which the dielectriccapping layer is deposited and adhesion of the dielectric capping layerto those metal wires and that this correlation is due to thetemperatures of the metal wires achieved during deposition of thedielectric capping layer. Specifically, the present inventors have foundthat, when the pattern density of the metal wires is relatively low, thetemperature of the metal wires achieved during BEOL plasma-enhancedchemical vapor deposition (PECVD) (e.g., high density plasma chemicalvapor deposition (HDPCVD)) of the dielectric capping layer over exposedmetal wires will also be relatively low and, thus, adhesion of thedielectric capping layer to the metal wires will be relatively low andthe rate of occurrence of delamination will be relatively high. Thepresent inventors have further found that, when the pattern density ofthe metal wires is relatively high, the temperature of the metal wiresachieved during BEOL PECVD (e.g., HDPCVD) of the dielectric cappinglayer over exposed metal wires will also be relatively high and, thus,adhesion of the dielectric capping layer to the metal wires will berelatively high and the rate of occurrence of delamination will berelatively low. Lastly, the present inventors have found that there isalso a significant correlation between the thickness of the ILD materialdeposited onto the dielectric capping layer and adhesion of thedielectric capping layer to the metal wires below and that thiscorrelation is due to the lack of expansion and contraction of the ILDmaterial. Specifically, a relatively thick ILD layer is typicallydeposited on and immediately adjacent to the dielectric capping layer ofa lower metal level. This thick ILD layer is then patterned withtrenches for the metal wires of the next metal level. The presentinventors have found that, during the ILD deposition process, thesubstrate is heated and, as a result, the metal wires in the metal levelbelow this ILD material will expand. When the metal wires begin to cool,they will contract. This expansion and contraction process has thebenefit of reducing tensile stress in the metal wires. However, when theILD layer is relatively thick, it will not flex or will exhibit onlyminimal flexing as the metal wires below expand and contract.Consequently, the thick ILD layer and metal wires act as opposing forcesthat can result in delamination at the interface between the dielectriccapping layer and metal wires.

In view of the foregoing, disclosed herein are embodiments of a methodof forming back end of the line (BEOL) metal levels with improveddielectric capping layer to metal wire adhesion. The embodiments includeone or more process steps that are designed to address dielectriccapping layer to metal wire adhesion, when the metal wire(s) in a givenmetal level are relatively thick (e.g., >1 μm, >2 μm, >3 μm, >5 μm,etc.). These process steps can include, for example: (1) selectiveadjustment of the deposition tool that is used to deposit the dielectriccapping layer onto metal wires based on the pattern density of the metalwires in order to ensure that those metal wires actually achieve atemperature between 360° C.-400° C.; and/or (2) deposition of arelatively thin dielectric layer onto the dielectric capping layer priorto formation of the next metal level in order to reduce the tensilestress of the metal wire(s) below without causing delamination. Alsodisclosed herein are embodiments of an IC chip that is formed using theabove described method embodiments and that thereby has a BEOL metallevel with improved dielectric capping layer to metal wire adhesion.

More specifically, FIG. 1 is a flow diagram illustrating a method offorming BEOL metal levels with improved dielectric capping layer tometal wire adhesion.

The method can comprise completing front end of the line (FEOL)processing and middle of the line (MOL) processing of a semiconductorwafer in order to form an integrated circuit (IC) device layer on asubstrate (102). The details of FEOL processing and MOL processing arewell known in the art and, thus, are omitted from this specification inorder to allow the reader to focus on the salient aspects of thedisclosed method.

During BEOL processing, a metal level, with relatively thick metalwire(s), can be formed above the device layer and, thereby above thesubstrate (104). It should be noted that this metal level can be thefirst metal level (i.e., M−1) above the device layer or some other metallevel above the device layer. In any case, this metal level can beformed by forming a first dielectric layer 211 (104, see FIG. 2). Thisfirst dielectric layer 211 can be formed using a chemical vapordeposition (CVD) process (e.g., a plasma-enhanced chemical vapordeposition (PECVD) process, such as a high-density plasma chemical vapordeposition (HDPCVD) process), a spin coating process or any othersuitable deposition process. This first dielectric layer 211 cancomprise, for example, a silicon dioxide (SiO₂) layer or any othersuitable interlayer dielectric material (e.g., borophosphosilicate glass(BPSG), tetraethyl orthosilicate (TEOS), fluorinated tetraethylorthosilicate (FTEOS), etc.). This first dielectric layer 211 can bedeposited such that it has a 210, which ranges, for example, from 1-8 μmsuch that it can accommodate relatively thick metal wire(s) (e.g., metalwire(s) having a thickness of 1-8 μm, as discussed in greater detailbelow).

Then, damascene and/or dual-damascene techniques can be used to form oneor more trenches 220 (i.e., wiring grooves) and, optionally, one or morevia openings 230 (106, see FIG. 3). For purpose of illustration, FIG. 3shows dual-damascene processing being performed to form both trench(es)and via opening(s). However, FIG. 3 is not intended to be limiting. Thatis, it should be understood that, alternatively, only damasceneprocessing can be performed to form only trench(es) and not viaopening(s). In any case, trench(es) 220 can be formed that extendvertically a predetermined depth 221 into the first dielectric layer 211from the top surface of the first dielectric layer 211. Each via opening230 (if any) can be formed so as to extend vertically from a bottom of atrench 220 down to a lower metal level or to the device layer (notshown). Such damascene and dual-damascene techniques are well known inthe art and, thus, are omitted from this specification in order to allowthe reader to focus on the salient aspects of the disclosed method. Theetch depth of the trenches 220 can be predetermined based on the desiredthickness of the resulting wires (e.g., between 1-8 μm, such as 3 μm, asdiscussed in greater detail below).

Once the trench(es) 220 and any via opening(s) 230 are formed, they canoptionally be lined (e.g., conformally or directionally) with aconductive diffusion barrier layer 241 (108, see FIG. 4). That is, anysuitable conductive material that exhibits high atomic diffusionresistance (i.e., a conductive diffusion barrier material that exhibitslow atomic diffusivity) can be deposited, using conventional depositiontechniques (e.g., physical vapor deposition (PVD), chemical vapordeposition (CVD), or other suitable technique) onto the bottom surfaceand sidewalls of the trench(es) 220 and any via opening(s) 230. Such aconductive diffusion barrier layer 241 can have a thickness ranging, forexample, from 200-2000 Angstroms and can comprise a cobalt layer, achromium layer, a ruthenium layer, a tantalum layer, a tantalum nitridelayer, an indium oxide layer, a tungsten layer, a tungsten nitridelayer, a titanium layer, a titanium nitride layer, or any other suitableconductive barrier material as described above.

Next, the trench(es) 220 and any via opening(s) 230 can be filled with ametal material 242, thereby forming relatively thick metal wire(s) 245and, if applicable, connecting via(s) 235 (110, see FIG. 5). This metalmaterial can comprise, for example, copper. Alternatively, the metalmaterial can comprise any suitable metal material for metal level wireformation. In any case, the metal wire(s), which as discussed above arerelatively thick due to the depth of the trench(es), can compriseconnecting wires or, alternatively, can comprise passive devices, suchas inductors or resistors, or components thereof, which have beenincorporated into the IC chip design. Following deposition of the metalmaterial, all conductive material can be removed from the top surface ofthe first dielectric layer 211 (e.g., using a chemical mechanicalpolishing (CMP) process).

Then, a second dielectric layer 212 (referred to herein as a dielectriccapping layer) can be formed on the first dielectric layer 211 (112, seeFIG. 6A). The second dielectric layer 212 can comprise, for example, asilicon nitride layer, a silicon oxynitride layer, or any other suitabledielectric capping layer. The second dielectric layer 212 can bedeposited so that it has a second thickness 214. This second thickness214 can be less than the depth 221 of the trench(es) 220 and, therebyless than the thickness of the first dielectric layer 211. For example,the second thickness 214 can be less than 20% and, more particularly,less than 10% of the depth 221 of the trench(es) 220. For example, thesecond thickness 214 of the second dielectric layer 212 can range from20-200 nm or, more particularly, from 50-70 nm.

In any case, this second dielectric layer 212 can be deposited so thatit is immediately adjacent to the first dielectric layer 211 and so thatit extends over the trench(es) 220 and is immediately adjacent to themetal wire(s) 245 (e.g., the copper wire(s)) contained therein. Thissecond dielectric layer 212 can be deposited using, for example, aplasma-enhanced chemical vapor deposition (PECVD) process, such as ahigh density plasma chemical vapor deposition (HDPCVD) process thatresults in the formation of self-aligned metal silicide layer(s) 243(e.g., self-aligned copper silicide layers when the metal wire(s) 245are copper wire(s)) in the upper portion(s) 223 of the trench(es) 220 atthe interface(s) between the second dielectric layer 212 (e.g., thesilicon nitride layer) and the metal wire(s) 245 (e.g., the copperwire(s)). The self-aligned metal silicide layer(s) 243 (e.g., the coppersilicide layer(s)) provide for better adhesion between the seconddielectric layer 212 (e.g., the silicon nitride layer) and the metalwire(s) 245 (e.g., the copper wire(s)) below, thereby minimizingdelamination.

Those skilled in the art will recognize that a PECVD system willtypically include a chamber. The upper portion of the chamber comprisesa dome and the lower portion comprises a substrate support surface. Thedome defines the upper boundary of a plasma processing region and thesubstrate support surface defines the lower boundary of the plasmaprocessing region. A vacuum system can adjust the pressure in thesystem. A plasma source system can generate plasma within the plasmaprocessing region. Optionally, a temperature control system can comprisea heat and/or cooling plate at the substrate support surface. A gasdelivery system allows for input of one or more different gasses intothe plasma within the plasma processing region. A control system can beoperably connected to each of these systems (e.g., the vacuum system,the plasma source system, the temperature control system (if applicable)and the gas delivery system) can be control operation of the system. ForPECVD using such a PECVD system, a wafer is placed on the substratesupport surface and, particularly, transferred into the chamber (e.g.,by a robot blade) through an insertion/removal opening in the side ofthe chamber and places on the substrate support surface. The plasma isgenerated and the gases required for the composition of the layer beingdeposited are input into the plasma. Those skilled in the art willrecognize that, when a wafer is with the chamber and exposed to plasma,it will heat up. Additionally, variations in the power imparted on theplasma will cause variations in the plasma energy and, therebyvariations in the rate at which the wafer heats up. Thus, although thetemperature of the plasma can not be directly controlled, the powerimparted on the plasma can be controlled in order to indirectly controlthe temperature of the plasma. Consequently, the composition of theplasma and/or the power imparted on the plasma can be selectivelyadjusted in order to selectively adjust the composition of the layerbeing deposited. For example, for a silicon nitride layer, the plasmacan comprise hydrogen (H₂) plasma. The gas delivery system can flow bothnitrogen and silane (SiH₄) can into the chamber. The vacuum system canset the pressure in the chamber so that it is within the range of 2-3Torr (e.g., 2.6 Torr). Additionally, the power imparted on the plasma bythe plasma source system can be set to ensure that the wafer, whenexposed to the plasma over time, can be heated to a temperature in therange of 360° C.-400° C. (e.g., 380° C.).

The present inventors have found that, when the pattern density of themetal wires is relatively high (e.g., greater than 33%), the exposedmetal wires 245 onto which the second dielectric layer 212 is beingdeposited will achieve a temperature within this range of 360° C.-400°C. (e.g., 380° C.) during the time required for deposition. However,when the pattern density of the metal wires 245 is relatively low (e.g.,lower than 33%), the exposed metal wires 245 onto which the seconddielectric layer 212 is being deposited will not achieve a temperaturewithin the range of 360° C.-400° C. For purpose of this disclosure, the“pattern density” of the metal wires refers to the ratio of metal todielectric material at the exposed surface onto which the seconddielectric layer 212 is being deposited. Thus, a pattern density that isgreater than 33% means that the ratio of metal to dielectric material isgreater than 1/3. Greater thermal coupling of the metal wires with ahigher pattern density as compared to lesser thermal coupling of metalwires with a lower pattern density is likely the cause of thetemperature difference.

In any case, the present inventors have further found that a metal wiretemperature range of 360° C.-400° C. (e.g., a copper wire temperaturerange of 360° C.-400° C.) ensures that the resulting self-aligned metalsilicide layer(s) 243 (e.g., the resulting self-aligned copper silicidelayers) will be relatively thick. That is, the metal silicide layer(s)243 will have a thickness 244 that is 1-3% of the depth 221 of thetrench(es) 220. For example, if thick copper wire(s) in trench(es) 220that are 3 μm deep achieve a temperature within the range of 360°C.-400° C. (e.g., 380° C.) during PECVD of a second dielectric layer 212(e.g., during deposition of a silicon nitride layer), then the resultingself-aligned copper silicide layer(s) 243 will be 30-90 nm thick. Acopper silicide layer that is 30-90 nm thick will optimize adhesion ofthe silicon nitride layer to the copper wire below and will, therebyminimize delamination.

Since metal wires with a low pattern density (e.g., a pattern density ofless than 33%) do not achieve the temperature range of 360° C.-400° C.during normal PECVD processing, the method disclosed herein providesthat during this process 112 of forming the second dielectric layer 212,the PECVD tool used to deposit the second dielectric layer 212 (e.g.,the silicon nitride layer) and, particularly, the settings on that toolcan be selectively adjusted based on the pattern density of the metalwires 245 (e.g., the pattern density of the copper wires) in order toensure that metal wires 245 (e.g., the copper wires) achieve the desiredtemperature within the range of 360° C.-400° C. during deposition of thesecond dielectric layer 212 (e.g., the silicon nitride layer). Forexample, one technique for ensuring that metal wires 245 (e.g., thecopper wires) with a low pattern density (e.g., as shown in FIG. 6B)achieve the desired temperature within the range of 360° C.-400° C.during deposition of the second dielectric layer 212 thereon cancomprise providing a warm up period within the PECVD chamber. Forexample, depending upon the pattern density of the metal wires,different H2-plasma exposure times can be instituted prior to flowingthe nitrogen and silane (SiH₄) into the chamber and beginning siliconnitride deposition in order to pre-heat the metal wires from above.Additionally and/or alternatively, if the chamber is configured with aheating plate at the substrate support plate this heating plate can beturned on for different periods of time prior to flowing the nitrogenand silane (SiH₄) into the chamber and beginning silicon nitridedeposition in order to pre-heat the metal wires from above. FIG. 7 is anexemplary LUT table that shows different wire pattern density ranges andcorresponding pattern density-specific warm-up times and, particularly,corresponding H2-plasma exposure times. Thus, for example, for astructure with a wire pattern density of less than 0.25, the wafer canbe exposed to the H2-plasma for 60 seconds prior to flowing the nitrogenand silane (SiH₄) into the chamber and beginning silicon nitridedeposition; whereas for a structure with a wire pattern density of 0.25up to 0.275 the wafer can be exposed to the H2-plasma for 55 secondsprior to flowing the nitrogen and silane (SiH₄) into the chamber andbeginning silicon nitride deposition; and so. In this example, anystructure with a wire pattern density of 0.33 or over would require awarm-up period of 40 seconds. It should be noted that, for illustrationpurposes, the LUT in FIG. 7 shows different wire pattern density rangesand corresponding pattern density-specific corresponding H2-plasmaexposure times. However, FIG. 7 is not intended to be limiting and anynumber of two or more wire pattern density ranges and correspondingpattern density-specific warm-up times could be used. Furthermore, itshould be noted that such a LUT table can be stored in memory andaccessed (e.g., by a user or the control system).

Next, a third dielectric layer 213 can be formed on the seconddielectric layer 212 (114, see FIG. 8). The third dielectric layer 213can comprise, for example, a different dielectric material than thatused for the second dielectric layer 212. For example, the thirddielectric layer 213 can comprise a silicon oxide layer, a siliconoxynitride layer, a hydrogenated silicon oxycarbide layer, etc.Alternatively, this third dielectric layer 213 can comprise the samedielectric material as the second dielectric layer 212. In any case,this third dielectric layer 213 can be deposited so that it has a thirdthickness 215. This third thickness 215 can be less than the depth 221of the trench(es) 220 and, thereby less than the thickness of the firstdielectric layer 211. This third thickness 215 can be approximatelyequal, slightly thicker than or slightly thinner than the secondthickness 214 of the second dielectric layer 212. Thus, for example, thethird thickness 215 of the third dielectric layer 213 can be less than20% and, more particularly, less than 10% of the depth 221 of thetrench(es) 220. For example, the third thickness 215 of the thirddielectric layer 213 can range from 20-200 nm or, more particularly,from 50-70 nm.

In any case, this third dielectric layer 213 can be deposited so that itis immediately adjacent to the second dielectric layer 212. This thirddielectric layer 213 can be deposited using, for example, a PECVDprocess, such as a HDPCVD. Thus, during deposition of the thirddielectric layer 213, the metal wire(s) 245 will concurrently be heatedcausing them to expand and, thereby reducing the tensile stressexhibited by the metal wire(s) 245. By reducing the tensile stress inthe metal wire(s) 245, the force exerted by the metal wire(s) 245downward and away from the second dielectric layer 212 is reduced. Thus,adhesion between the second dielectric layer 212 and the metal wire(s)245 is improved. It should be noted that, since this process ofdepositing the third dielectric layer 213 and concurrently heating themetal wire(s) 245 to reduce tensile stress is performed prior toformation of a subsequent metal level, which includes a relatively thickand un-flexible dielectric layer, and since it results in only a thinthird dielectric layer being formed, when the metal wire(s) 245eventually cool and contract, the thin third dielectric layer 213 canflex minimizing the opposing forces that could result in delamination ofthe second dielectric layer from the metal wire(s) 245 below. Formationof the third dielectric layer 213, as shown in FIG. 8, completesformation of the metal level 201 at process 104.

After the third dielectric layer 213 is formed, an additional metallevel 202 can be formed on this third dielectric layer 213 (116, seeFIGS. 9-11).

Specifically, an additional first dielectric layer 211′ can be formedimmediately adjacent to the third dielectric layer 213 (see FIG. 9).This additional first dielectric layer 211′ can be formed using a PECVDprocess, such as an HDPCVD process, a spin coating process or any othersuitable deposition process. This additional first dielectric layer 211′can comprise, for example, a silicon dioxide (SiO₂) layer or any othersuitable interlayer dielectric material (e.g., borophosphosilicate glass(BPSG), tetraethyl orthosilicate (TEOS), fluorinated tetraethylorthosilicate (FTEOS), etc.). This additional first dielectric layer211′ can be deposited such that it has the same the thickness as thefirst dielectric layer 211 or a different thickness, which is stillgreater than the thickness of the third dielectric layer 213 below.

Then, damascene and/or dual-damascene techniques can be used to form oneor more additional trenches 220′ (i.e., wiring grooves) and, optionally,one or more additional via openings 230′ (see FIG. 10). Specifically,additional trench(es) 220′ can be formed that extending vertically apredetermined depth into the additional first dielectric layer 211′ inorder to accommodate a metal wire of a given thickness. Each additionalvia opening 230′ can be formed so as to extend vertically from a bottomof an additional trench 220′ through a lower portion of the additionalfirst dielectric layer 211′, through the third dielectric layer 213 andthrough the second dielectric layer 212 to a metal wire 245 in the metallevel 201 below.

Once the additional trench(es) 220′ and any additional via opening(s)230′ are formed, additional processing can proceed in essentially thesame manner as described above with regard to process steps 108-112 and,optionally, with regard to process step 114. That is, the additionaltrench(es) 220′ and any additional via opening(s) 230′ can optionally belined with a conductive diffusion barrier layer and filled with anadditional metal material (e.g., to form additional metal wire(s) 245′and, if applicable, additional connecting via(s) 235′). The additionalmetal material can be the same metal as that used to form the metalwires 245 (e.g., copper) or, alternatively, can be any other suitablemetal material (e.g., aluminum, tungsten, etc.). Following deposition ofthe additional metal material, a CMP process can be performed to removeall conductive material from the top surface of the additional firstdielectric layer 211′.

Next, an additional second dielectric layer 212′ (e.g., an additionaldielectric capping layer, such as a silicon nitride layer) can be formedon the additional first dielectric layer 211′ and self-aligned metalsilicide layer(s) 243′ can concurrently be formed in the upperportion(s) of the additional trench(es) 243′ at the interfaces betweenthe additional metal wire(s) 245′ and the additional second dielectriclayer 245′. The additional second dielectric layer 212′ can berelatively thin (e.g., 20-200 nm or, more particularly, 50-70 nm). Itshould be noted that, if the additional metal wire(s) 245′ arerelatively thick (e.g., 1-3 μm), this additional second dielectric layer212′ can be deposited using a PECVD technique, wherein the settings onthat PECVD tool are selectively adjusted based on the pattern density ofthe additional metal wires 245′ in order to ensure that the additionalmetal wires 245′ achieve a desired temperature and, thereby to ensurethat the additional self-aligned metal silicide layer(s) 243′ having adesired thickness.

Furthermore, if the additional metal wire(s) 245′ are relatively thick(e.g., 1-3 μm), an additional third dielectric layer 213′, which isrelatively thin (e.g., 20-200 nm or, more particularly, 50-70 nm), canbe formed on the additional second dielectric layer 212′ to reduce thetensile stress of the additional metal wire(s) prior to formation of anyother metal levels thereon (see FIG. 11).

Referring to FIG. 11, also disclosed herein are embodiments of an ICchip 200 that is formed using the above described method and thatthereby has a BEOL metal level 201 with improved dielectric cappinglayer to metal wire adhesion.

Specifically, the IC chip structure 200 can comprise a substrate and anIC device layer above the substrate. The IC chip structure 200 canfurther comprise a metal level 201, with relatively thick metal wire(s)245, above the device layer and, thereby above the substrate. It shouldbe noted that this metal level 201 can be the first metal level (i.e.,M−1) above the device layer or some other metal level above the devicelayer.

In any case, this metal level 201 can comprise a first dielectric layer211. This first dielectric layer 211 can comprise, for example, asilicon dioxide (SiO₂) layer or any other suitable interlayer dielectricmaterial (e.g., borophosphosilicate glass (BPSG), tetraethylorthosilicate (TEOS), fluorinated tetraethyl orthosilicate (FTEOS),etc.). This first dielectric layer 211 can have a first thickness 210,which ranges, for example, from 1-8 μm such that it can accommodaterelatively thick metal wire(s) 245 (e.g., metal wire(s) having athickness of 1-8 μm, as discussed in greater detail below).

The metal level 201 can further comprise one or more trenches 220 (i.e.,wiring grooves) and, optionally, one or more via openings 230.Specifically, the trench(es) 220 can be in an upper portion of the firstdielectric layer 211 and can extend vertically a predetermined depth 221into the first dielectric layer 211 from the top surface of the firstdielectric layer 211. Each via opening 230 can extend vertically from abottom of a trench 220 to a lower metal level or to the device layer(not shown). The trench(es) 220 and any via opening(s) 230 canoptionally be lined with a conductive diffusion barrier layer 241. Thatis, any suitable conductive material that exhibits high atomic diffusionresistance (i.e., a conductive diffusion barrier material that exhibitslow atomic diffusivity) can line the bottom surface and sidewalls of thetrench(es) 220 and any via opening(s) 230. Such a conductive diffusionbarrier layer 241 can have a thickness ranging, for example, from200-2000 Angstroms and can comprise a cobalt layer, a chromium layer, aruthenium layer, a tantalum layer, a tantalum nitride layer, an indiumoxide layer, a tungsten layer, a tungsten nitride layer, a titaniumlayer, a titanium nitride layer, or any other suitable conductivebarrier material as described above. Any via opening(s) 230 and at leastthe lower portion(s) 222 of the trench(es) 220 can be filled with ametal material 242, thereby forming relatively thick metal wire(s) 245and, if applicable, connecting via(s) 235. This metal material cancomprise, for example, copper. Alternatively, the metal material cancomprise any suitable metal material for metal level wire formation. Inany case, the metal wire(s), which as discussed above are relativelythick due to the depth of the trench(es), can comprise connecting wiresor, alternatively, can comprise passive devices, such as inductors orresistors, or components thereof, which have been incorporated into theIC chip design.

The metal level 201 can further comprise self-aligned metal silicidelayer(s) 243 (e.g., self-aligned copper silicide layers when the metalwire(s) 245 are copper wire(s)). The self-aligned metal silicidelayer(s) 243 can be in the upper portion(s) 223 of the trench(es) 220above and immediately adjacent to the metal wire(s) 245 (e.g.,immediately adjacent to copper wire(s)). The self-aligned metal silicidelayer(s) 243 can be relatively thick. That is, the self-aligned metalsilicide layer(s) 243 can have a thickness 244 that is 1-3% of the depth221 of the trench(es) 220. For example, self-aligned copper silicidelayer(s) 243 that is/are 30-90 nm thick can be in upper portion(s) 223of deep trench(es) 220 (e.g., trenches that are 3 μm deep) above andimmediately adjacent to copper metal wire(s) 245.

The metal level 201 can further comprise a second dielectric layer 212(referred to herein as a dielectric capping layer) on the firstdielectric layer 211 and extending laterally over the trench(es) 220 soas to be immediately adjacent to the self-aligned metal silicidelayer(s) 243. The second dielectric layer 212 can comprise, for example,a silicon nitride layer, a silicon oxynitride layer, or any othersuitable dielectric capping layer. The second dielectric layer 212 canhave a second thickness 214. This second thickness 214 can be less thanthe depth 221 of the trench(es) 220 and, thereby less than the thicknessof the first dielectric layer 211. For example, the second thickness 214can be less than 20% and, more particularly, less than 10% of the depth221 of the trench(es) 220. For example, the second thickness 214 of thesecond dielectric layer 212 can range from 20-200 nm or, moreparticularly, from 50-70 nm.

The metal level 201 can further comprise third dielectric layer 213 onthe second dielectric layer 212. The third dielectric layer 213 cancomprise, for example, a different dielectric material than that usedfor the second dielectric layer 212. For example, the third dielectriclayer 213 can comprise a silicon oxide layer, a silicon oxynitridelayer, a hydrogenated silicon oxycarbide layer, etc. Alternatively, thisthird dielectric layer 213 can comprise the same dielectric material asthe second dielectric layer 212. In any case, this third dielectriclayer 213 can have a third thickness 215. This third thickness 215 canbe less than the depth 221 of the trench(es) 220 and, thereby less thanthe thickness of the first dielectric layer 211. This third thickness215 can be approximately equal to the second thickness 214 of the seconddielectric layer 212, slightly thicker than the second thickness 214 ofthe second dielectric layer 212, or slightly thicker than the secondthickness 214 of the second dielectric layer 212. Thus, for example, thethird thickness 215 of the third dielectric layer 213 can be less than20% and, more particularly, less than 10% of the depth 221 of thetrench(es) 220. For example, the third thickness 215 of the thirddielectric layer 213 can range from 20-200 nm or, more particularly,from 50-70 nm.

The IC structure 200 can further comprise an additional metal level 202on the third dielectric layer 213. It should be noted that the thinthird dielectric layer 213 is thin enough to be flexible duringprocessing prior to formation of the additional metal level 202, therebyallowing the metal wire(s) 245 below to expand and contract withoutsignificant opposing forces being exerted at the interface(s) betweenthe second dielectric layer 212 and the metal wire(s) 245. Thus,formation of this third dielectric layer during processing minimizesdelamination of the second dielectric layer 212 from the metal wire(s)245 below.

In any case, the additional metal level 202 can comprise an additionalfirst dielectric layer 211′. This additional first dielectric layer 211′can comprise, for example, a silicon dioxide (SiO₂) layer or any othersuitable interlayer dielectric material (e.g., borophosphosilicate glass(BPSG), tetraethyl orthosilicate (TEOS), fluorinated tetraethylorthosilicate (FTEOS), etc.). This additional first dielectric layer211′ can have the same the thickness as the first dielectric layer 211or a different thickness, which is still greater than the thickness ofthe third dielectric layer 213 below.

The additional metal level 202 can further comprise one or moreadditional trenches 220′ (i.e., wiring grooves) that extend vertically apredetermined depth into the additional first dielectric layer 211′ and,optionally, one or more additional via openings 230′, wherein each viaopening extends vertically from a bottom of an additional trench 220′through a lower portion of the additional first dielectric layer 211′,through the third dielectric layer 213 and through the second dielectriclayer 212 to a metal wire 245 in the metal level 201 below. Theadditional trench(es) 220′ and any additional via opening(s) 230′ canoptionally be lined with a conductive diffusion barrier layer. Anadditional metal material can fill any additional via openings 230′,thereby forming connecting vias 235′, and can further fill at least thelower portion(s) of the additional trench(es) 220′, thereby formingadditional metal wire(s) 245′. The additional metal material can be thesame metal material as used in the metal wires 245 (e.g., copper) or,alternatively, can be any other suitable metal material (e.g., aluminum,tungsten, etc.).

The additional metal level 202 can further comprise additionalself-aligned metal silicide layer(s) 243′ in the upper portion(s) of theadditional trench(es) 220′ above and immediately adjacent to theadditional metal wire(s) 245′. The additional self-aligned additionalmetal silicide layer(s) 243′ can be relatively thick. For example, theadditional self-aligned metal silicide layer(s) 243′ can have athickness that is 1-3% of the depth of the trench(es) 220.

The additional metal level 202 can further comprise an additional seconddielectric layer 212′ (referred to herein as an additional dielectriccapping layer) on the additional first dielectric layer 211′ andextending laterally over the additional trench(es) 220′ so as to beimmediately adjacent to the additional self-aligned metal silicidelayer(s) 243′. The additional second dielectric layer 212′ can comprise,for example, a silicon nitride layer, a silicon oxynitride layer, or anyother suitable dielectric capping layer. The additional seconddielectric layer 212′ can be relatively thin (e.g., 20-200 nm or, moreparticularly, 50-70 nm). It should be noted that, if the additionalmetal wire(s) 245′ are relatively thick (e.g., 1-3 μm), this additionalsecond dielectric layer 212′ can be deposited using a PECVD technique,wherein the settings on that PECVD tool are selectively adjusted basedon the pattern density of the additional metal wires 245′ in order toensure that the additional metal wires 245′ achieve a desiredtemperature and, thereby to ensure that the self-aligned metal silicidelayer(s) 243′ having a desired thickness.

Optionally, if the additional metal wire(s) 245′ are relatively thick(e.g., 1-3 μm), the additional metal level 202 can further comprise anadditional third dielectric layer 213′. This additional third dielectriclayer 213′ can be above and immediately adjacent to the additionalsecond dielectric layer 212′ and below any upper metal levels. Thisadditional third dielectric layer 213′ can be relatively thin (e.g.,20-200 nm or, more particularly, 50-70 nm).

The method as described above is used in the fabrication of integratedcircuit chips. The resulting integrated circuit chips can be distributedby the fabricator in raw wafer form (that is, as a single wafer that hasmultiple unpackaged chips), as a bare die, or in a packaged form. In thelatter case the chip is mounted in a single chip package (such as aplastic carrier, with leads that are affixed to a motherboard or otherhigher level carrier) or in a multichip package (such as a ceramiccarrier that has either or both surface interconnections or buriedinterconnections). In any case the chip is then integrated with otherchips, discrete circuit elements, and/or other signal processing devicesas part of either (a) an intermediate product, such as a motherboard, or(b) an end product. The end product can be any product that includesintegrated circuit chips, ranging from toys and other low-endapplications to advanced computer products having a display, a keyboardor other input device, and a central processor.

It should be understood that the terminology used herein is for thepurpose of describing the disclosed method and structure and is notintended to be limiting. For example, as used herein, the singular forms“a”, “an” and “the” are intended to include the plural forms as well,unless the context clearly indicates otherwise. Additionally, as usedherein, the terms “comprises” “comprising”, “includes” and/or“including” specify the presence of stated features, integers, steps,operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or groups thereof. Furthermore, asused herein, terms such as “right”, “left”, “vertical”, “horizontal”,“top”, “bottom”, “upper”, “lower”, “under”, “below”, “underlying”,“over”, “overlying”, “parallel”, “perpendicular”, etc., are intended todescribe relative locations as they are oriented and illustrated in thedrawings (unless otherwise indicated) and terms such as “touching”,“on”, “in direct contact”, “abutting”, “directly adjacent to”, etc., areintended to indicate that at least one element physically contactsanother element (without other elements separating the describedelements). The corresponding structures, materials, acts, andequivalents of all means or step plus function elements in the claimsbelow are intended to include any structure, material, or act forperforming the function in combination with other claimed elements asspecifically claimed.

Therefore, disclosed above are embodiments of a method of forming backend of the line (BEOL) metal levels with improved dielectric cappinglayer to metal wire adhesion. The embodiments include one or moreprocess steps that are designed to address dielectric capping layer tometal wire adhesion, when the metal wire(s) in a given metal level arerelatively thick (e.g., >1 μm, >2 μm, >3 μm, etc.). These process stepscan include, for example: (1) selective adjustment of the depositiontool that is used to deposit the dielectric capping layer onto metalwires based on the pattern density of the metal wires in order to ensurethat those metal wires actually achieve a temperature between 360°C.-400° C.; and/or (2) deposition of a relatively thin dielectric layeronto the dielectric capping layer prior to formation of the next metallevel in order to reduce the tensile stress of the metal wire(s) belowwithout causing delamination. Also disclosed above are embodiments of anIC chip that is formed using the above described method embodiments andthat thereby has a BEOL metal level with improved dielectric cappinglayer to metal wire adhesion.

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to best explain theprinciples of the embodiments, the practical application or technicalimprovement over technologies found in the marketplace, or to enableothers of ordinary skill in the art to understand the embodimentsdisclosed herein.

1-16. (canceled)
 17. A structure comprising: a metal level above asubstrate, the metal level comprising: a first dielectric layer having afirst thickness; a trench in the first dielectric layer; a metalmaterial in the trench so as to form a metal wire; a second dielectriclayer immediately adjacent to the first dielectric layer and above themetal wire, the second dielectric layer having a second thickness andcomprising a silicon nitride layer; and a third dielectric layer on thesecond dielectric layer, the third dielectric layer having a thirdthickness, and the first thickness being greater than the secondthickness and the third thickness; and, an additional metal level on thethird dielectric layer.
 18. The structure of claim 17, the seconddielectric layer and the third dielectric layer comprising differentdielectric materials.
 19. The structure of claim 17, the trench having adepth, and the second thickness and the third thickness each being lessthan 10% of the depth.
 20. The structure of claim 17, the additionalmetal level comprising: an additional first dielectric layer immediatelyadjacent to the third dielectric layer, the additional first dielectriclayer being thicker than the second dielectric layer and the thirddielectric layer; an additional trench in an upper portion of theadditional first dielectric layer; a via opening extending verticallyfrom the additional trench through a lower portion of the additionalfirst dielectric layer, through the third dielectric layer and throughthe second dielectric layer to the metal wire; an additional metalmaterial filling the additional trench and the via opening; and anadditional second dielectric layer on the additional first dielectriclayer.
 21. The structure of claim 20, the additional metal materialbeing different from the metal material.
 22. A structure comprising: ametal level above a substrate, the metal level comprising: a firstdielectric layer having a first thickness; trenches in the firstdielectric layer; copper in the trenches so as to form copper wires;self-aligned copper silicide layers in the trenches above the copper; asecond dielectric layer immediately adjacent to the first dielectriclayer and above the copper wires, the second dielectric layer having asecond thickness and comprising a silicon nitride layer, and theself-aligned copper silicide layers being between and immediatelyadjacent to the silicon nitride layer and the copper; and a thirddielectric layer on the second dielectric layer, the third dielectriclayer having a third thickness, and the first thickness being greaterthan the second thickness and the third thickness; and, an additionalmetal level on the third dielectric layer.
 23. The structure of claim22, the third dielectric layer comprising a silicon oxide layer.
 24. Thestructure of claim 22, the trenches containing the copper wires having adepth that is at least 3 microns, the second thickness and the thirdthickness each being less than 10% of the depth, and the self-alignedcopper silicide layers each having a fourth thickness that isapproximately 1-3% of the depth.
 25. The structure of claim 22, theadditional metal level comprising: an additional first dielectric layerimmediately adjacent to the third dielectric layer, the additional firstdielectric layer being thicker than the second dielectric layer and thethird dielectric layer; an additional trench in an upper portion of theadditional first dielectric layer; a via opening extending verticallyfrom the additional trench through a lower portion of the additionalfirst dielectric layer, through the third dielectric layer and throughthe second dielectric layer to one of the copper wires; an additionalmetal material filling the additional trench and the via opening; and,an additional second dielectric layer on the additional first dielectriclayer.
 26. A structure comprising: a metal level above a substrate, themetal level comprising: a first dielectric layer having a firstthickness; a trench in the first dielectric layer; a metal material inthe trench so as to form a metal wire; a second dielectric layer aboveand immediately adjacent to the first dielectric layer and further abovethe metal wire, the second dielectric layer having a second thickness;and a third dielectric layer above and immediately adjacent to thesecond dielectric layer and comprising a same dielectric material as thesecond dielectric layer, the third dielectric layer having a thirdthickness, and the first thickness being greater than the secondthickness and the third thickness; and, an additional metal level on thethird dielectric layer.
 27. The structure of claim 26, the thirdthickness being less than the second thickness.
 28. The structure ofclaim 26, the second dielectric layer and the third dielectric layercomprising silicon nitride layers.
 29. The structure of claim 26, thetrench having a depth, and the second thickness and the third thicknesseach being less than 10% of the depth.
 30. The structure of claim 26,the additional metal level comprising: an additional first dielectriclayer immediately adjacent to the third dielectric layer, the additionalfirst dielectric layer being thicker than the second dielectric layerand the third dielectric layer; an additional trench in an upper portionof the additional first dielectric layer; a via opening extendingvertically from the additional trench through a lower portion of theadditional first dielectric layer, through the third dielectric layerand through the second dielectric layer to the metal wire; an additionalmetal material filling the additional trench and the via opening; and anadditional second dielectric layer on the additional first dielectriclayer.
 31. The structure of claim 30, the additional metal materialbeing different from the metal material.
 32. A structure comprising: ametal level above a substrate, the metal level comprising: a firstdielectric layer having a first thickness; trenches in the firstdielectric layer; copper in the trenches so as to form copper wires;self-aligned copper silicide layers in the trenches above the copper; asecond dielectric layer above and immediately adjacent to the firstdielectric layer and above the copper wires, the second dielectric layerhaving a second thickness, and the self-aligned copper silicide layersbeing between and immediately adjacent to the second dielectric layerand the copper wires; and a third dielectric layer above and immediatelyadjacent to the second dielectric layer and comprising a same dielectricmaterial as the second dielectric layer, the third dielectric layerhaving a third thickness, and the first thickness being greater than thesecond thickness and the third thickness; and, an additional metal levelon the third dielectric layer.
 33. The structure of claim 32, the thirdthickness being less than the second thickness.
 34. The structure ofclaim of claim 32, the second dielectric layer and the third dielectriclayer comprising silicon nitride layers.
 35. The structure of claim 32,the trenches containing the copper wires having a depth that is at least3 microns, the second thickness and the third thickness each being lessthan 10% of the depth, and the self-aligned copper silicide layers eachhaving a fourth thickness that is approximately 1-3% of the depth. 36.The structure of claim 32, the additional metal level comprising: anadditional first dielectric layer immediately adjacent to the thirddielectric layer, the additional first dielectric layer being thickerthan the second dielectric layer and the third dielectric layer; anadditional trench in an upper portion of the additional first dielectriclayer; a via opening extending vertically from the additional trenchthrough a lower portion of the additional first dielectric layer,through the third dielectric layer and through the second dielectriclayer to one of the copper wires; an additional metal material fillingthe additional trench and the via opening; and, an additional seconddielectric layer on the additional first dielectric layer.
 37. Thestructure of claim 17, the third thickness being less than the secondthickness.
 38. The structure of claim 22, the third thickness being lessthan the second thickness.
 39. The structure of claim 17, the thirddielectric layer comprising a plasma chemical vapor deposited layer thatreduces tensile stress exhibited by the metal wire before formation ofthe additional metal level on the third dielectric layer.
 40. Thestructure of claim 22, the third dielectric layer comprising a plasmachemical vapor deposited layer that reduces tensile stress exhibited bythe copper wires before formation of the additional metal level on thethird dielectric layer.
 41. The structure of claim 26, the thirddielectric layer comprising a plasma chemical vapor deposited layer thatreduces tensile stress exhibited by the metal wire before formation ofthe additional metal level on the third dielectric layer.